Sputtering target with ultra-fine, oriented grains and method of making same

US5590389A · kind A · utility

Assignee

• Johnson Matthey Electronics, Inc. · US

Inventors

• John A. Dunlop · Spokane Valley, US
• Jun Yuan · San Diego, US
• Janine Kardokus · San Jose, US
• Roger Emigh · Mesa, US

Key dates

• Filing date: Dec 23, 1994
• Grant date: Dec 31, 1996
• Expiry date: Dec 23, 2014

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B22F2998/10
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A sputtering target comprising a body of metal such as aluminum and its alloy with an ultrafine grain size and small second phase. Also described is a method for making an ultra-fine grain sputtering target comprising melting, atomizing, and depositing atomized metal to form a workpiece, and fabricating the workpiece to form a sputtering target. A method is also disclosed that includes the steps of extruding a workpiece through a die having contiguous, transverse inlet and outlet channels of substantially identical cross section, and fabricating the extruded article into a sputtering target. The extrusion may be performed several times, producing grain size of still smaller size and controlled grain texture.