Roger Emigh
11Patents
7h-index
17Co-inventors
59Inventor score
Filing activity: Dec 23, 1994 → Jun 6, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5590389A | Sputtering target with ultra-fine, oriented grains and method of making same | Performing Operations; Transporting | 52 | Expired |
| US6775140B2 | Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices | Electricity | 50 | Expired |
| US5687600A | Metal sputtering target assembly | Chemistry; Metallurgy | 41 | Expired |
| US5809393A | Sputtering target with ultra-fine, oriented grains and method of making same | Performing Operations; Transporting | 41 | Expired |
| US6713151B1 | Compliant fibrous thermal interface | Emerging Cross-Sectional Technologies | 31 | Expired |
| US6740972B2 | Electronic device having fibrous interface | Electricity | 26 | Expired |
| US5780755A | Sputtering target with ultra-fine, oriented grains and method of making same | Performing Operations; Transporting | 23 | Expired |
| US7064430B2 | Stacked die packaging and fabrication method | Electricity | 7 | Expired |
| US6617199B2 | Electronic device having fibrous interface | Electricity | 2 | Expired |
| US7968377B2 | Integrated circuit protruding pad package system | Electricity | 1 | Active |
| US8587098B2 | Integrated circuit protruding pad package system and method for manufacturing thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.