Wafer transfer apparatus
US5590996A · kind A · utility
15Cited by
7References
65Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 1994 |
| Grant date | Jan 7, 1997 |
| Priority date | — |
| Expiry date | Oct 13, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer transfer apparatus capable of simultaneously transferring multiple semiconductor wafers to and from a furnace or similar columnar wafer station. The apparatus has a cantilevered extension which extends from a main part. The extension is preferably mounted for pivotal movement. The extension has a distal engagement head mounted thereon. The distal engagement head is moved between a lateral position and an upstanding engaging position. The engagement head has a plurality of wafer support features which support the far edges of a group of wafers. The near edges of the wafers are held by proximal wafer contact heads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.