Polyester dispersants for high thermal conductivity paste
US5591789A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Jan 7, 1997 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/01
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A paste composition having a high thermal conductivity and a relatively low viscosity is used to provide a thermal conductive connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The paste composition comprises a non-aqueous dielectric carrier, thermally conductive filler particles and a specially defined dispersant comprising the self-condensation reaction product of a hydroxy fatty acid, the reaction product having an acid number of about 30-100. A 12-hydroxy stearic acid self condensed reaction product is the preferred dispersant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.