Wafer polishing machine with fluid bearings and drive systems
US5593344A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 1994 |
| Grant date | Jan 14, 1997 |
| Priority date | — |
| Expiry date | Oct 11, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semi-conductor wafer polishing machine having a polishing pad assembly and a wafer holder includes a support positioned adjacent the polishing pad assembly. This support has at least one fluid inlet connectable to a source of fluid at a higher pressure, at least one fluid outlet connectable to a fluid drain at a lower pressure, and at least one bearing surface over which fluid flows from the source to the drain. The polishing pad is supported by the fluid over the bearing surface for low-friction movement with respect to the support. Similar fluid bearings can be used in the wafer holder. An array of generally parallel grooves is provided on a belt support surface to reduce hydroplaning of a polishing belt. A turbine drive system rotates a wafer chuck in a wafer holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.