Process for making a multileveled electronic package
US5593720A · kind A · utility
2Cited by
14References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 1995 |
| Grant date | Jan 14, 1997 |
| Priority date | — |
| Expiry date | May 23, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.