Apparatus and method for depositing charge on a semiconductor wafer
US5594247A · kind A · utility
82Cited by
30References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1995 |
| Grant date | Jan 14, 1997 |
| Priority date | — |
| Expiry date | Jul 7, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A conductive screen is placed between a corona gun and the surface of a semiconductor wafer. The charge deposited on the wafer by the gun is controlled by a potential applied to the screen. A chuck orients the wafer in close proximity to the screen. A desired charge is applied to the wafer by first applying a surplus of one charge to the wafer and then depositing an opposite polarity charge until the potential of the wafer equals the potential of the screen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.