Method of producing micromechanical structures

US5595940A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Hans-Peter Trah · Reutlingen, DE
• Franz Laermer · Stuttgart, DE
• Andrea Schilp · Schwäbisch Gmünd, DE

Key dates

• Filing date: May 22, 1995
• Grant date: Jan 21, 1997
• Expiry date: May 22, 2015

Classification

• Technology area (CPC G): Physics
• CPC primary: G01P15/0802
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

In a method of producing micromechanical structures on semiconductor components, in particular on the surface of a wafer containing integrated circuits, provision is made for the micromechanical structures to be provided subsequently on a fully processed semiconductor component using process steps which are normally applied in semiconductor component production and are at most slightly modified, but independently of the semiconductor component production process.