Multi-tier laminate substrate with internal heat spreader
US5597643A · kind A · utility
24Cited by
6References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 13, 1995 |
| Grant date | Jan 28, 1997 |
| Priority date | — |
| Expiry date | Mar 13, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-tier laminate substrate with an internal heat spreader and method for making a multi-tier laminate substrate with an internal heat spreader for electronic device packaging are provided wherein a spacing mechanism is used to protect the bond fingers of a trace on a lower tier of the laminated substrate when a milling bit is used to cut an opening above a die cavity in the multi-tier substrate,.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.