Patrick Weber
56Patents
16h-index
61Co-inventors
87Inventor score
Filing activity: Feb 2, 1995 → Dec 8, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6038136A | Chip package with molded underfill | Electricity | 164 | Expired |
| US5798014A | Methods of making multi-tier laminate substrates for electronic device packaging | Emerging Cross-Sectional Technologies | 157 | Expired |
| US5609889A | Apparatus for encapsulating electronic packages | Emerging Cross-Sectional Technologies | 66 | Expired |
| US6615091B1 | Control system and method therefor | Performing Operations; Transporting | 66 | Expired |
| US6324069A | Chip package with molded underfill | Emerging Cross-Sectional Technologies | 59 | Expired |
| US6667439B2 | Integrated circuit package including opening exposing portion of an IC | Electricity | 57 | Expired |
| US7171281B2 | Control system and method therefor | Performing Operations; Transporting | 48 | Expired |
| US5622588A | Methods of making multi-tier laminate substrates for electronic device packaging | Emerging Cross-Sectional Technologies | 42 | Expired |
| US7049166B2 | Methods and apparatus for making integrated circuit package including opening exposing portion of the IC | Electricity | 33 | Expired |
| US6157086A | Chip package with transfer mold underfill | Emerging Cross-Sectional Technologies | 33 | Expired |
| US5652463A | Transfer modlded electronic package having a passage means | Electricity | 32 | Expired |
| US5776512A | Apparatus for encapsulating electronic packages | Emerging Cross-Sectional Technologies | 31 | Expired |
| US6560122B2 | Chip package with molded underfill | Emerging Cross-Sectional Technologies | 24 | Expired |
| US5597643A | Multi-tier laminate substrate with internal heat spreader | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6128195A | Transfer molded PCMCIA standard cards | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5728248A | Method for making a multi-tier laminate substrate with internal heat spreader | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5929522A | Semiconductor non-laminate package and method | Electricity | 13 | Expired |
| USD791294S1 | Modular fire pit | General | 11 | Active |
| US5689137A | Method for transfer molding standard electronic packages and apparatus formed thereby | Performing Operations; Transporting | 11 | Expired |
| US6495083B2 | Method of underfilling an integrated circuit chip | Emerging Cross-Sectional Technologies | 10 | Expired |
| US9651191B1 | Modular basin apparatus | Human Necessities | 10 | Active |
| US5766986A | Method of transfer molding electronic packages and packages produced thereby | Electricity | 6 | Expired |
| US6316291A | Method of fabricating a non-laminate carrier substrate utilizing a mold | Electricity | 6 | Expired |
| US7831323B2 | Control system and method therefor | Performing Operations; Transporting | 6 | Active |
| US10201233B2 | Modular basin apparatus | Human Necessities | 5 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.