Method for testing and burning-in a semiconductor wafer
US5597737A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 1995 |
| Grant date | Jan 28, 1997 |
| Priority date | — |
| Expiry date | Nov 3, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Flip-chip is fast becoming the mounting method of choice in the semiconductor industry for dice having a high number of contacts. Since many applications require known-good-die, these flip-chip semiconductor dice must be tested and burned-in. By testing and burning-in the semiconductor wafers prior to solder bumping, the probe tips (42, 44, 46 & 48) can contact the hard planar surface of the under-bump-metallurgy (40) on each bonding pad (14) for easier and more reliable contact and hence test results. The probe tips can be either of an array (42 & 44) or cantilevered needle (46 & 48) type. Blunt probe tips (42 & 48) are well-suited to making contact on the shoulder of each bonding pad of each semiconductor die, while sharp probe tips (44 & 46) are preferable for contacting the center of each bonding pad. Solder bumping is performed post-testing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.