Method and apparatus for testing an integrated circuit using controlled wirebonding and wirebonding removal
US5598096A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1994 |
| Grant date | Jan 28, 1997 |
| Priority date | — |
| Expiry date | Dec 2, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/859
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for testing an integrated circuit includes a bond substrate having a location for an integrated circuit. The location on the bond substrate has a plurality of traces around each location. A first fixture holds the bond substrate in a fixed relation to first fixture and holds the integrated circuit in a fixed relation to the first fixture and the bond substrate. A wirebonder forms wirebonds between the traces and the bond pads. An electrical tester provides electrical signals from the traces to the bond pads to verifying the operation of the integrated circuit. A second fixture lifts the bond substrate while the integrated circuit remains held to the first fixture. A vibrator vibrates the first fixture in relation to the second fixture so that the wirebonds are broken at a predetermined location near the bond pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.