Method and structure for attaching a circuit module to a circuit board
US5598967A · kind A · utility
12Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 1995 |
| Grant date | Feb 4, 1997 |
| Priority date | — |
| Expiry date | Apr 4, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of interconnecting circuit modules (30) to mother boards (50) each having a plurality of mating solder pads (32, 52) is available. The solder pads (32, 52) have respective pairs of arms (40, 42) and (54, 56) with a venting channel (36, 58) formed between each pair of arms to vent solder medium when the solder pads are reflowed to interconnect the circuit modules and mother boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.