Molded product of a polypropylene resin
US5599865A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 1995 |
| Grant date | Feb 4, 1997 |
| Priority date | — |
| Expiry date | May 8, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a molded product containing 65 to 95% by weight of a polymer composition and 5 to 35% by weight of an inorganic filler. The polymer composition is a mixture of 45 to 70 parts by weight of a polypropylene resin having a melt flow rare of 10 to 60 g/10 minute and containing 0 to 8% by weight of ethylene, and 30 to 55 parts by weight of an amorphous ethylene-.alpha.-olefin copolymer. The proportion (D) of the filler and that (C) of the copolymer have the relation expressed as D>155-37 lnC. The copolymer is a mixture of 30 to 60% by weight of a high-molecular copolymer having a weight-average molecular weight of 380,000 to 1,000,000 and 40 to 70% by weight of a low-molecular one having weight-average molecular weight of 150,000 to 330,000. The product has a coefficient of linear expansion not exceeding 5.0.times.10.sup.-5 cm/cm/.degree.C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.