Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor
US5601675A · kind A · utility
28Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1994 |
| Grant date | Feb 11, 1997 |
| Priority date | — |
| Expiry date | Dec 6, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronics device has unpackaged chips or other small components mounted on a carrier and wire-bonded to carrier wiring traces. The rear chip faces have a layer of adhesive which overlies a layer of solder or other fusible material, and which adheres to a pad area of the carrier. To replace a chip, its solder layer is melted, and the chip and adhesive are pulled off. Reapplying an adhesive layer allows a new chip to be mounted on the carrier and bonded to the traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.