Mark K. Hoffmeyer
89Patents
17h-index
94Co-inventors
87Inventor score
Filing activity: Feb 26, 1991 → Jul 19, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5757998A | Multigigabit adaptable transceiver module | Physics | 86 | Expired |
| US5769989A | Method and system for reworkable direct chip attach (DCA) structure with thermal enhancement | Emerging Cross-Sectional Technologies | 61 | Expired |
| US6084775A | Heatsink and package structures with fusible release layer | Electricity | 33 | Expired |
| US6076726A | Pad-on-via assembly technique | Emerging Cross-Sectional Technologies | 32 | Expired |
| US8326754B2 | Method and system for processing transactions | Physics | 32 | Active |
| USH1471H | Metal substrate double sided circuit board | General | 30 | Active |
| US5601675A | Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor | Emerging Cross-Sectional Technologies | 28 | Expired |
| US6134776A | Heatsink and package structure for wirebond chip rework and replacement | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5910644A | Universal surface finish for DCA, SMT and pad on pad interconnections | Electricity | 26 | Expired |
| US6300578A | Pad-on-via assembly technique | Emerging Cross-Sectional Technologies | 26 | Expired |
| US5873512A | Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier | Electricity | 24 | Expired |
| US7658617B1 | Plastic land grid array (PLGA) module with inverted hybrid land grid array (LGA) interposer | Electricity | 23 | Active |
| US5789930A | Apparatus and method to test for known good die | Emerging Cross-Sectional Technologies | 21 | Expired |
| US5757073A | Heatsink and package structure for wirebond chip rework and replacement | Emerging Cross-Sectional Technologies | 21 | Expired |
| US7486516B2 | Mounting a heat sink in thermal contact with an electronic component | Emerging Cross-Sectional Technologies | 18 | Active |
| US6497582B1 | LGA connector with integrated gasket | Electricity | 18 | Expired |
| US6024580A | High performance pad on pad connector for flex circuit packaging | Electricity | 17 | Expired |
| US8267701B2 | Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing | Electricity | 17 | Active |
| US7199309B2 | Structure for repairing or modifying surface connections on circuit boards | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5806753A | Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier | Electricity | 15 | Expired |
| US5651493A | Method of performing solder joint analysis of semi-conductor components | Emerging Cross-Sectional Technologies | 15 | Expired |
| US7435622B2 | High performance reworkable heatsink and packaging structure with solder release layer and method of making | Electricity | 13 | Active |
| US6784377B2 | Method and structure for repairing or modifying surface connections on circuit boards | Emerging Cross-Sectional Technologies | 13 | Expired |
| US7342306B2 | High performance reworkable heatsink and packaging structure with solder release layer | Electricity | 12 | Expired |
| US7606033B2 | Mounting a heat sink in thermal contact with an electronic component | Emerging Cross-Sectional Technologies | 11 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.