Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
US5601678A · kind A · utility
31Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 1995 |
| Grant date | Feb 11, 1997 |
| Priority date | — |
| Expiry date | Jan 23, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a multi-layer circuit board which includes electrical interconnections between adjacent circuit board layers of the multi-layer board. A via hole is provided through a circuit board layer. The via hole is filled with a via metal. The via metal is plated with a low melting point metal. An adhesive film is deposited over the circuit board layer. Adjacent layers of the multi-layer circuit board are stacked and aligned together. The layers are laminated under heat and pressure. The low melting point metal provides an electrical interconnection between adjacent layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.