Joel A. Gerber
10Patents
9h-index
12Co-inventors
65Inventor score
Filing activity: Nov 22, 1983 → Oct 17, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6260264A | Methods for making z-axis electrical connections | Emerging Cross-Sectional Technologies | 156 | Expired |
| US7170185B1 | Solvent assisted burnishing of pre-underfilled solder bumped wafers for flipchip bonding | Emerging Cross-Sectional Technologies | 115 | Expired |
| US5685939A | Process for making a Z-axis adhesive and establishing electrical interconnection therewith | Electricity | 65 | Expired |
| US5401913A | Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board | Emerging Cross-Sectional Technologies | 60 | Expired |
| US6063647A | Method for making circuit elements for a z-axis interconnect | Emerging Cross-Sectional Technologies | 53 | Expired |
| US6246010A | High density electronic package | Electricity | 38 | Expired |
| US5601678A | Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board | Emerging Cross-Sectional Technologies | 31 | Expired |
| US5873161A | Method of making a Z axis interconnect circuit | Emerging Cross-Sectional Technologies | 26 | Expired |
| US6791036B1 | Circuit elements using z-axis interconnect | Emerging Cross-Sectional Technologies | 17 | Expired |
| US4700253A | Slanted pole head for magnetic recording | Physics | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.