Semiconductor wafer polishing appartus and method
US5605487A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 1994 |
| Grant date | Feb 25, 1997 |
| Priority date | — |
| Expiry date | May 13, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus for polishing semiconductor wafers comprises a housing, a mounting apparatus within the housing for wax mounting a first face of a semiconductor wafer to a first face of a polishing block, and a first semiconductor wafer polisher within the housing for polishing a second face of the semiconductor wafer. The second face of the semiconductor wafer is opposite the first face of the semiconductor wafer. A first transfer mechanism is within the housing for delivering the polishing block and semiconductor wafer from the mounting apparatus to adjacent the first semiconductor wafer polisher. A controller controls operation of the mounting apparatus, the first semiconductor wafer polisher, and the first transfer mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.