Polishing apparatus of semiconductor wafer
US5605488A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1994 |
| Grant date | Feb 25, 1997 |
| Priority date | — |
| Expiry date | Oct 27, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A plurality of cells are provided in a concave portion of a top plate. A cloth to which water is penetrated is provided in a back face of each cell, and a wafer is attracted by the cloth. First and second pipes are connected to each cell. The first pipe introduces liquid to the cell, and the second pipe discharges liquid from the cell, and guides liquid to the first pipe. A constant-temperature device is provided to each first pipe, and a temperature of liquid of each cell is adjusted by the constant-temperature device in accordance with a temperature distribution of the wafer. Whereby, a polishing rate of each part of the wafer can be equalized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.