Ichiro Katakabe
12Patents
8h-index
22Co-inventors
68Inventor score
Filing activity: Oct 27, 1994 → Jul 28, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5605488A | Polishing apparatus of semiconductor wafer | Performing Operations; Transporting | 136 | Expired |
| US5643046A | Polishing method and apparatus for detecting a polishing end point of a semiconductor wafer | Performing Operations; Transporting | 120 | Expired |
| US6921466B2 | Revolution member supporting apparatus and semiconductor substrate processing apparatus | Electricity | 27 | Expired |
| US6558478B1 | Method of and apparatus for cleaning substrate | Emerging Cross-Sectional Technologies | 26 | Expired |
| US5943578A | Method of manufacturing a semiconductor device having an element isolating region | Electricity | 16 | Expired |
| US5880032A | Method and apparatus for manufacturing a semiconductor device | Emerging Cross-Sectional Technologies | 12 | Expired |
| US5878191A | Heat treatment apparatus for semiconductor wafers | Electricity | 9 | Expired |
| US7578886B2 | Substrate processing apparatus, substrate processing method, and substrate holding apparatus | Performing Operations; Transporting | 8 | Expired |
| US6745784B2 | Method of and apparatus for cleaning substrate | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6776919B2 | Method and apparatus for etching ruthenium films | Electricity | 3 | Expired |
| US7578887B2 | Apparatus for and method of processing substrate | Electricity | 3 | Expired |
| US7309449B2 | Substrate processing method | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.