Semiconductor wafer support apparatus and method
US5605574A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1995 |
| Grant date | Feb 25, 1997 |
| Priority date | — |
| Expiry date | Sep 20, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B31/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The wafer support apparatus and method provide a plurality of elastic supports having a smooth curvature for contacting a wafer at a respective plurality of support points. Each elastic support directly contacts the wafer at a support point and expands and/or compresses independently of the other elastic supports to accommodate the bending of the wafer during processing. A wafer support apparatus includes a plurality of flexible elastic supports onto which a wafer is directly positioned, wherein each of the plurality of elastic supports holds the wafer during processing by compressing or expanding in response to bending of the wafer during processing to provide continuous even support for the wafer during processing. A wafer support method includes the steps of providing a plurality of flexible elastic supports and positioning a wafer to be processed directly on the plurality of elastic supports, wherein each of the plurality of elastic supports holds the wafer during processing by compressing or expanding in response to bending of the wafer during processing to provide continuous even support for the wafer during processing. The elastic supports may be manufactured using a method …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.