Molded plastic semiconductor package including heat spreader
US5608267A · kind A · utility
268Cited by
41References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 1994 |
| Grant date | Mar 4, 1997 |
| Priority date | — |
| Expiry date | Jul 18, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a molded plastic electronic package having improved thermal dissipation. A thermal dissipator, such as a heat spreader or a heat slug is partially encapsulated in the molding resin. The thermal dissipator has a density less than that of copper and a coefficient of thermal conductivity that is constant or increases as the package periphery is approached.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.