Fluxless soldering method
US5609290A · kind A · utility
28Cited by
5References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 1995 |
| Grant date | Mar 11, 1997 |
| Priority date | — |
| Expiry date | Apr 20, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A fluxless soldering method utilizing a strongly internally bonded fluorine containing gas such as hydrogen fluoride (HF). The solder surface is exposed to the gas in place of a flux treatment, resulting in a modified surface layer which allows reflow or joining for an extended period.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.