Article and method of manufacturing an enclosed electrical circuit using an encapsulant
US5612513A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1995 |
| Grant date | Mar 18, 1997 |
| Priority date | — |
| Expiry date | Sep 19, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example, each circuit can contain a conductive trace, a battery and a die, all in electrical communication. During the manufacturing process, a barrier is placed on the substrate and a curable encapsulant is poured into a cavity formed by the barrier and the substrate to encapsulate each circuit. The barrier can be formed as a compartmentalized dam having a separate cavity for each circuit, as a perimeter dam having a single cavity, or as a spacer sheet having a separate cavity for each circuit formed by a pattern of cut outs. Following the encapsulation step, the electrical circuits can be singulated into separate encapsulated circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.