Mark E. Tuttle
279Patents
52h-index
78Co-inventors
93Inventor score
Filing activity: Jan 22, 1990 → Jan 22, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6130602A | Radio frequency data communications device | Electricity | 369 | Expired |
| US5384284A | Method to form a low resistant bond pad interconnect | Emerging Cross-Sectional Technologies | 329 | Expired |
| US5232875A | Method and apparatus for improving planarity of chemical-mechanical planarization operations | Emerging Cross-Sectional Technologies | 311 | Expired |
| US8106520B2 | Signal delivery in stacked device | Emerging Cross-Sectional Technologies | 285 | Active |
| US6167614A | Method of manufacturing and testing an electronic device, and an electronic device | Emerging Cross-Sectional Technologies | 282 | Expired |
| US5621913A | System with chip to chip communication | Electricity | 260 | Expired |
| US6735183B2 | Radio frequency data communications device | Electricity | 234 | Expired |
| US6037879A | Wireless identification device, RFID device, and method of manufacturing wireless identification device | Physics | 230 | Expired |
| US5907477A | Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant | Emerging Cross-Sectional Technologies | 229 | Expired |
| US5020283A | Polishing pad with uniform abrasion | Emerging Cross-Sectional Technologies | 214 | Expired |
| US5177908A | Polishing pad | Emerging Cross-Sectional Technologies | 207 | Expired |
| US6852550B2 | MRAM sense layer area control | Electricity | 205 | Expired |
| US5234867A | Method for planarizing semiconductor wafers with a non-circular polishing pad | Performing Operations; Transporting | 201 | Expired |
| US5297364A | Polishing pad with controlled abrasion rate | Emerging Cross-Sectional Technologies | 177 | Expired |
| US6693513B2 | Wireless identification device, RFID device with push-on/push off switch, and method of manufacturing wireless identification device | Electricity | 176 | Expired |
| US5779839A | Method of manufacturing an enclosed transceiver | Emerging Cross-Sectional Technologies | 174 | Expired |
| US5421769A | Apparatus for planarizing semiconductor wafers, and a polishing pad for a planarization apparatus | Performing Operations; Transporting | 172 | Expired |
| US5151168A | Process for metallizing integrated circuits with electrolytically-deposited copper | Electricity | 158 | Expired |
| US6045652A | Method of manufacturing an enclosed transceiver | Emerging Cross-Sectional Technologies | 156 | Expired |
| US6785159B2 | Combination etch stop and in situ resistor in a magnetoresistive memory and methods for fabricating same | Electricity | 147 | Expired |
| US6375780B1 | Method of manufacturing an enclosed transceiver | Emerging Cross-Sectional Technologies | 146 | Expired |
| US5142438A | Dram cell having a stacked capacitor with a tantalum lower plate, a tantalum oxide dielectric layer, and a silicide buried contact | Electricity | 143 | Expired |
| US5558679A | Method for mounting a battery on a substrate | Emerging Cross-Sectional Technologies | 139 | Expired |
| US7300857B2 | Through-wafer interconnects for photoimager and memory wafers | Electricity | 135 | Expired |
| US7106201B2 | Communication devices, remote intelligent communication devices, electronic communication devices, methods of forming remote intelligent communication devices and methods of forming a radio frequency identification device | Physics | 118 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.