Thin IC card and method for producing the same
US5612532A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 9, 1995 |
| Grant date | Mar 18, 1997 |
| Priority date | — |
| Expiry date | Nov 9, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thin IC card which is highly reliable, simple in construction and structure, to which a function section relating to main information processing can be easily attached, and which has improved portability, and a method for producing it are disclosed. This thin IC card is characterized by including a plate type IC module in which a semiconductor device having at least memory function and CPU function has its one side sealed or molded with a resin, and flat type externally connecting terminals have their one end connected to the input/output terminals of the semiconductor device and the other end led and exposed to a non-resin sealed or molded side, and a card-like support which has a fitting section for fitting the plate type IC module with the surface of the externally connecting terminals of the plate type IC module exposed to be substantially flush with the surface of the card, a required circuit wiring, an antenna for sending and receiving a signal without contacting, and if necessary an oscillator for specifying a frequency and a power supply battery.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.