Hiroshi Iwasaki
174Patents
32h-index
194Co-inventors
93Inventor score
Filing activity: Jul 23, 1974 → Dec 20, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5822190A | Card type memory device and a method for manufacturing the same | Emerging Cross-Sectional Technologies | 226 | Expired |
| US5710458A | Card like semiconductor device | Electricity | 187 | Expired |
| US6137710A | Connecting apparatus, and information processing apparatus | Electricity | 159 | Expired |
| US4774556A | Non-volatile semiconductor memory device | Electricity | 154 | Expired |
| US5892273A | Semiconductor package integral with semiconductor chip | Electricity | 114 | Expired |
| US5550709A | External storage device | Electricity | 97 | Expired |
| US6002605A | Connecting apparatus, and information processing apparatus | Electricity | 97 | Expired |
| USD369157S | IC card | General | 88 | Expired |
| US4484388A | Method for manufacturing semiconductor Bi-CMOS device | Electricity | 87 | Expired |
| US5011930A | Quinoline type mevalonolactones | Chemistry; Metallurgy | 80 | Expired |
| US7137012B1 | Storage medium and contents protection method using the storage medium | Physics | 64 | Expired |
| US5612532A | Thin IC card and method for producing the same | Electricity | 62 | Expired |
| US5786271A | Production of semiconductor package having semiconductor chip mounted with its face down on substrate with protruded electrodes therebetween and semiconductor package | Electricity | 58 | Expired |
| US5677575A | Semiconductor package having semiconductor chip mounted on board in face-down relation | Electricity | 56 | Expired |
| US7454780B2 | Service providing system and method | Electricity | 50 | Expired |
| US6288527A | Two-dimensional sensor using laps for measuring cell activity | Emerging Cross-Sectional Technologies | 50 | Expired |
| US4637125A | Method for making a semiconductor integrated device including bipolar transistor and CMOS transistor | Electricity | 48 | Expired |
| US6651149B1 | Data storage medium with certification data | Physics | 46 | Expired |
| USD427167S | Adapter for an IC card | General | 45 | Expired |
| US5599389A | Compound semiconductor and method of manufacturing the same | Electricity | 44 | Expired |
| US6085412A | Method for manufacturing card type memory device | Emerging Cross-Sectional Technologies | 44 | Expired |
| US6054774A | Thin type semiconductor package | Electricity | 43 | Expired |
| US4010038A | Process for producing microcapsules | Emerging Cross-Sectional Technologies | 39 | Expired |
| US5773882A | Seminconductor package | Electricity | 38 | Expired |
| US6141210A | External storage device | Electricity | 38 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.