Apparatus for reducing the intensity and frequency of arcs which occur during a sputtering process
US5616224A · kind A · utility
39Cited by
5References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 9, 1995 |
| Grant date | Apr 1, 1997 |
| Priority date | — |
| Expiry date | May 9, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/0206
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus for reducing the intensity and frequency of arcing in a reactive DC sputtering process when the process uses an arc-suppression system which interrupts or reverses the voltage applied to the sputtering target. A plasma having required properties is introduced into the vicinity of the sputtering target by means of a separate plasma applicator which operates independently of the target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.