Photosensitive resin composition and a process for forming a patterned polyimide film using the same
US5616448A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 26, 1996 |
| Grant date | Apr 1, 1997 |
| Priority date | — |
| Expiry date | Jan 26, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0387
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The composition comprises (A) a specified polyimide precursor and (B) at least one member selected from the group consisting of a sensitizer, a photopolymerization initiator and a combination thereof. The above process comprises applying a solution of the above photosensitive resin composition on a substrate, followed by drying to form a film; exposing the film to light, followed by developing with an aqueous alkaline solution to form a patterned film; and curing the patterned film. The composition has little ionic impurities mixed therein during the preparation of the composition; is excellent in storage stability in the state of a solution; can be developed with an aqueous alkaline solution, which does not cause the problems such as a problem to health and a problem to the treatment of waste liquids, within a short time; and exhibits a good sensitivity even when formed a thick film, thereby readily providing a patterned resinous film. Further, the cured product obtained by curing the patterned film has a superior heat resistance and excellent electrical and mechanical properties, which can be suitably used as a protective film for use in electronic parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.