Semiconductor integrated circuit devices having particular terminal geometry
US5616962A · kind A · utility
48Cited by
17References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 1994 |
| Grant date | Apr 1, 1997 |
| Priority date | — |
| Expiry date | Nov 28, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of mounting semiconductor integrated circuit devices comprising steps of forming a semiconductor device block having a plurality of semiconductor integrated circuit devices of vertical mounting type coupled to each other in parallel, and mounting the semiconductor device block on a printed board. A block of semiconductor integrated circuit devices comprising a plurality of semiconductor integrated circuit devices of vertical mounting type, and coupling means for coupling the plurality of semiconductor integrated circuit devices each other in parallel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.