Selective WSix deposition
US5618756A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 1996 |
| Grant date | Apr 8, 1997 |
| Priority date | — |
| Expiry date | Apr 29, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/28518
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for selectively depositing WSi.sub.x is described. Semiconductor device structures are provided in and on a semiconductor substrate wherein WSi.sub.x is to be deposited overlying a first portion of the substrate and wherein WSi.sub.x is not to be deposited overlying a second portion of the substrate. A layer of organic material is provided over the surface of the substrate overlying the second portion of the substrate. A layer of WSi.sub.x is deposited over the surface of the substrate wherein the WSi.sub.x is deposited overlying the first portion of the substrate and wherein the presence of the organic material layer prevents the WSi.sub.x from depositing overlying the second portion of the substrate completing the selective WSi.sub.x deposition in the fabrication of an integrated circuit device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.