Methods of and apparatus for immobilizing semiconductor wafers during sawing thereof
US5618759A · kind A · utility
46Cited by
3References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 31, 1995 |
| Grant date | Apr 8, 1997 |
| Priority date | — |
| Expiry date | May 31, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/2033
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of immobilizing both (i) a semiconductor wafer (16) during the sawing thereof to form individual chips (18) and (ii) the resulting chips (18) as and after sawing of the wafer (16) is completed. A negative pressure is applied to the wafer (16) through a wafer carrier (12) to immobilize the wafer and individual chips. The negative pressure is applied to the wafer via ports (30) in alignment with the location of each chip (18) to be formed. A grid (40) or negative pressure is used to restrain the chips as they are subsequently transported following sawing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.