Multi-wavelength programmable laser processing mechanisms and apparatus
US5620618A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1995 |
| Grant date | Apr 15, 1997 |
| Priority date | — |
| Expiry date | Apr 28, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A desired design for electronic structures is converted into a graphic design format and sorted into a pseudo-raster format corresponding to scan lines. A laser or other machining beam is controlled by a separate tracking beam utilizing a mid-objective scanning system. The firing frequency of the machining beam is determined by the position of the tracking beam on a detector, as compared to the scan line data. Accuracy is verified by detection of plume or spectra generated during machining. Alignment of the machining and tracking beams is by interferometric methods. The system improves optical performance parameters of telecentricity, angle of scanned beam line, location of line in which the scanned line resides, astigmatism and field curvature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.