Process for manufacturing a resin molded image pick-up semiconductor chip having a window
US5622873A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 1995 |
| Grant date | Apr 22, 1997 |
| Priority date | — |
| Expiry date | Jan 23, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for packaging a solid type image pick-up device and a device produced by the packaging process. The process includes the steps of: forming a protecting layer on a light receiving region of an image pick-up chip formed on a semiconductor wafer; separating the image pick-up chip after forming the protecting layer; attaching the image pick-up chip on a lead frame and connecting leads of the lead frame to a pad of the separated image pick-up chip; sealing the chip within a chip-receiving body by molding with a resin and by using a mold having a projection, the projection extending to the protecting layer; and removing the protecting layer, and sealing a transparent plate on a cavity formed by the projection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.