Method for reclaiming substrate from semiconductor wafers
US5622875A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 17, 1994 |
| Grant date | Apr 22, 1997 |
| Priority date | — |
| Expiry date | Aug 17, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of reclaiming a substrate wafer and a reclaimed substrate wafer. A semiconductor wafer having external layers from previous processing is reclaimed by etching the external layers and cup-wheel grinding an active surface of the wafer to remove semiconductor components such as diffused regions. Either the active surface or the backside of the wafer is then polished to a mirror finish to provide a highly crystalline surface. The cup-wheel grinding produces a pinwheel surface roughness pattern and is accomplished by grinding the wafer with a cup-shaped grinding wheel having an axis of rotation parallel to but offset from an axis of rotation of the wafer. Preferably, the rim of the cup-shaped grinding wheel always passes over the axis of rotation of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.