Kobe Precision Inc.
8Patents
0Active
8Granted
27Portfolio score
Filing activity: Aug 17, 1994 → May 16, 2005
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5622875A | Method for reclaiming substrate from semiconductor wafers | Emerging Cross-Sectional Technologies | 46 | Expired |
| US5855735A | Process for recovering substrates | Electricity | 45 | Expired |
| US6406923B1 | Process for reclaiming wafer substrates | Electricity | 17 | Expired |
| US6451696B1 | Method for reclaiming wafer substrate and polishing solution compositions therefor | Electricity | 15 | Expired |
| US6384415B1 | Method of evaluating quality of silicon wafer and method of reclaiming the water | Physics | 10 | Expired |
| US7452481B2 | Polishing slurry and method of reclaiming wafers | Electricity | 10 | Expired |
| US6884634B2 | Specifying method for Cu contamination processes and detecting method for Cu contamination during reclamation of silicon wafers, and reclamation method of silicon wafers | Electricity | 9 | Expired |
| US7699997B2 | Method of reclaiming silicon wafers | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.