Semiconductor device in a resin package housed in a frame having high thermal conductivity
US5625222A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1994 |
| Grant date | Apr 29, 1997 |
| Priority date | — |
| Expiry date | Jul 27, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device including a substrate, solder bumps provided on a lower major surface of the substrate, a semiconductor chip provided on an upper major surface of the substrate, a resin package body provided on the upper major surface of the substrate so as to bury the semiconductor chip therein, a thermally conductive frame member having a flange part supporting the substrate at a rim part of the substrate, wherein the thermal conductive frame member has a thermal conductivity substantially larger than that of the resin package body and extending along to and in an intimate contact with side walls of the resin package body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.