Yoshiyuki Yoneda
50Patents
21h-index
75Co-inventors
91Inventor score
Filing activity: Nov 7, 1986 → Jan 6, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5625222A | Semiconductor device in a resin package housed in a frame having high thermal conductivity | Emerging Cross-Sectional Technologies | 654 | Expired |
| US5656550A | Method of producing a semicondutor device having a lead portion with outer connecting terminal | Emerging Cross-Sectional Technologies | 267 | Expired |
| US6159770A | Method and apparatus for fabricating semiconductor device | Emerging Cross-Sectional Technologies | 172 | Expired |
| US6072239A | Device having resin package with projections | Emerging Cross-Sectional Technologies | 161 | Expired |
| US6025650A | Semiconductor device including a frame terminal | Electricity | 149 | Expired |
| US6573121B2 | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame | Emerging Cross-Sectional Technologies | 88 | Expired |
| US6376921B1 | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame | Emerging Cross-Sectional Technologies | 83 | Expired |
| US6329711A | Semiconductor device and mounting structure | Emerging Cross-Sectional Technologies | 81 | Expired |
| US6255740A | Semiconductor device having a lead portion with outer connecting terminals | Emerging Cross-Sectional Technologies | 75 | Expired |
| US5521432A | Semiconductor device having improved leads comprising palladium plated nickel | Emerging Cross-Sectional Technologies | 53 | Expired |
| US6794273B2 | Semiconductor device and manufacturing method thereof | Electricity | 46 | Expired |
| US5497032A | Semiconductor device and lead frame therefore | Electricity | 45 | Expired |
| US5930603A | Method for producing a semiconductor device | Electricity | 42 | Expired |
| US5804468A | Process for manufacturing a packaged semiconductor having a divided leadframe stage | Electricity | 36 | Expired |
| US5569625A | Process for manufacturing a plural stacked leadframe semiconductor device | Emerging Cross-Sectional Technologies | 35 | Expired |
| US6875638B2 | Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board | Electricity | 32 | Expired |
| US6469370B1 | Semiconductor device and method of production of the semiconductor device | Electricity | 30 | Expired |
| US6995044B2 | Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board | Electricity | 26 | Expired |
| US6781224B2 | Semiconductor device and package including forming pyramid mount protruding through silicon substrate | Electricity | 26 | Expired |
| US5767527A | Semiconductor device suitable for testing | Electricity | 22 | Expired |
| US6472744B2 | Semiconductor module including a plurality of semiconductor devices detachably | Electricity | 21 | Expired |
| US6207477A | Semiconductor device having a ball grid array and a fabrication process thereof | Electricity | 21 | Expired |
| US5475259A | Semiconductor device and carrier for carrying semiconductor device | Electricity | 20 | Expired |
| US6069408A | Semiconductor device and method of manufacturing semiconductor device | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5666064A | Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device | Electricity | 16 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.