Processing method and equipment for processing a semiconductor device having holder/carrier with flattened surface
US5628828A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1995 |
| Grant date | May 13, 1997 |
| Priority date | — |
| Expiry date | Mar 3, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Process equipment and method for processing a semiconductor device comprising a buffer chamber, at least one process chamber connected to the buffer chamber through an opening portion, a holding/carrying unit disposed at a position facing the opening portion for holding and carrying a member to be processed such as a wafer, and a carrier unit disposed in the buffer chamber for transferring the member to be processed to and from the holding/carrying unit. The holding/carrying unit includes a flattened surface closely facing the opening portion for holding an atmosphere in the at least one process chamber independently from an atmosphere in the buffer chamber. The opening portion has a flattened surface closely facing the flattened surface of the holding/carrying unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.