Printed wiring board and method of manufacturing in which a basefilm including conductive circuits is covered by a cured polyimide resin lay
US5629497A · kind A · utility
7Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 1995 |
| Grant date | May 13, 1997 |
| Priority date | — |
| Expiry date | Oct 4, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0355
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A prepreg having an opening portion is placed on a cover lay which covers conductive circuits formed on a basefilm. A copper foil sheet is placed on the prepreg in such a way that the copper foil sheet covers the opening portion. The copper foil sheet has no opening portion. Next, the basefilm, the prepreg, and the copper foil are thermocompressed to become one laminate. After making a hole in the laminate, the laminate is plated, and then a through-hole is formed. A conductive circuit is formed by etching the copper foil sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.