CMK Corporation
17Patents
7Active
17Granted
38Portfolio score
Filing activity: Nov 29, 1993 → Dec 13, 2010 · 7 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7489032B2 | Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same | Electricity | 209 | Expired |
| US7279750B2 | Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion | Electricity | 203 | Expired |
| US7910405B2 | Semiconductor device having adhesion increasing film to prevent peeling | Electricity | 190 | Active |
| US7183639B2 | Semiconductor device and method of manufacturing the same | Electricity | 33 | Expired |
| US5633480A | Printed wiring board having a cover lay laminated on a polyimide resin base film containing conductive circuits | Electricity | 11 | Expired |
| US5629497A | Printed wiring board and method of manufacturing in which a basefilm including conductive circuits is covered by a cured polyimide resin lay | Electricity | 7 | Expired |
| US7615411B2 | Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof | Electricity | 7 | Active |
| US7867828B2 | Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein | Electricity | 6 | Active |
| US7894200B2 | Printed wiring board with built-in semiconductor element, and process for producing the same | Emerging Cross-Sectional Technologies | 6 | Active |
| US5377406A | Process for producing a printed circuit board | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7087845B2 | Metal core multilayer printed wiring board | Electricity | 5 | Expired |
| US8035979B2 | Printed wiring board with built-in semiconductor element, and process for producing the same | Emerging Cross-Sectional Technologies | 3 | Active |
| US7363706B2 | Method of manufacturing a multilayer printed wiring board | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7243425B2 | Printed wiring board and method of manufacturing the same | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7445964B2 | Semiconductor device and method of manufacturing the same | Electricity | 2 | Active |
| US7608480B2 | Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion | Electricity | 1 | Active |
| US7709942B2 | Semiconductor package, including connected upper and lower interconnections | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.