Flip-chip semiconductor devices having two encapsulants
US5629566A · kind A · utility
146Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 1995 |
| Grant date | May 13, 1997 |
| Priority date | — |
| Expiry date | Aug 7, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor chip which is connected to a circuit substrate via solder bumps by flip-chip connection, a first encapsulant having a large Young's modulus and filling a space between the semiconductor chip and the circuit substrate in the central portion of the semiconductor chip, and a second encapsulant having a small Young's modulus and filling a space between the semiconductor chip and the circuit substrate in the peripheral portion of the semiconductor chip. A method for manufacturing the semiconductor device includes flowing the second encapsulant into position, but not the first encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.