Kazuhide Doi
10Patents
7h-index
22Co-inventors
62Inventor score
Filing activity: Aug 5, 1994 → Mar 5, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5629566A | Flip-chip semiconductor devices having two encapsulants | Electricity | 146 | Expired |
| US5648686A | Connecting electrode portion in semiconductor device | Emerging Cross-Sectional Technologies | 100 | Expired |
| US5801447A | Flip chip mounting type semiconductor device | Electricity | 94 | Expired |
| US6111317A | Flip-chip connection type semiconductor integrated circuit device | Electricity | 91 | Expired |
| US5530289A | Semiconductor device and method of manufacturing the same | Electricity | 15 | Expired |
| US5645123A | Semiconductor device having temperature regulation means formed in circuit board | Electricity | 13 | Expired |
| US6742701B2 | Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus | Electricity | 9 | Expired |
| US9033248B2 | Semiconductor storage device | Electricity | 1 | Active |
| US8575738B2 | Semiconductor memory card | Electricity | 0 | Active |
| US9236329B2 | Semiconductor memory card | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.