Metal ball grid array package with improved thermal conductivity
US5629835A · kind A · utility
79Cited by
28References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1994 |
| Grant date | May 13, 1997 |
| Priority date | — |
| Expiry date | Jul 19, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is disclosed components for electronic packaging applications having integral bumps. A leadframe is formed by etching a metallic strip from one side to form outwardly extending, substantially perpendicular integral bumps. The metallic strip is then etched from the opposite side to form individual leads. When the integrally bumped component is an package base, fatigue of solder balls is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.