Patent · US Expired

Capacitive semiconductor pressure sensor

US5631428A · kind A · utility

19Cited by
3References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 22, 1995
Grant dateMay 20, 1997
Priority date
Expiry dateNov 22, 2015

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01L9/0042
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A micromechanically manufacturable pressure sensor has a cavity produced in an auxiliary layer that is covered with a membrane layer, the cavity is produced via recesses in the membrane layer. These recesses are subsequently closed by portions of a closure layer. Further layers can be applied on the closure layer. Portions of the further layers and closure layer are removed above the membrane layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.