Capacitive semiconductor pressure sensor
US5631428A · kind A · utility
19Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 1995 |
| Grant date | May 20, 1997 |
| Priority date | — |
| Expiry date | Nov 22, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0042
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromechanically manufacturable pressure sensor has a cavity produced in an auxiliary layer that is covered with a membrane layer, the cavity is produced via recesses in the membrane layer. These recesses are subsequently closed by portions of a closure layer. Further layers can be applied on the closure layer. Portions of the further layers and closure layer are removed above the membrane layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.