Method and apparatus for automated quality control in wafer slicing
US5632666A · kind A · utility
29Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1994 |
| Grant date | May 27, 1997 |
| Priority date | — |
| Expiry date | Oct 28, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An internal diameter saw, and in particular a method for operation which facilitates the maintenance of quality control of semiconductor wafers sliced from an ingot of source material. The internal diameter saw has a controller which monitors the deflection of the cutting edge of the blade at a location within the ingot as a wafer is sliced. Depending upon the deflection of the blade which is detected within the crystal, a blade dressing device is automatically activated to sharpen the blade following the cut.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.