Process for manufacturing lead frame for semiconductor package
US5633206A · kind A · utility
7Cited by
11References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1995 |
| Grant date | May 27, 1997 |
| Priority date | — |
| Expiry date | Nov 14, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing a lead frame having a pad, inner leads, outer leads and dambars, the lead frame being coated with a film on the back surface of the pad, which includes the steps of preparing a lead frame having a pad, inner leads and outer leads; placing a polyamic acid film on the back surface of the pad without using adhesive; and thermally compressing the polyamic acid film by using a heat; generator, to form polyimide film and simultaneously adhere that to the polyimide film the back surface of the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.