Printed wiring board having a cover lay laminated on a polyimide resin base film containing conductive circuits
US5633480A · kind A · utility
11Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 1995 |
| Grant date | May 27, 1997 |
| Priority date | — |
| Expiry date | Oct 4, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0154
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Conductive circuits (copper foil) are provided on both surfaces of a basefilm. A first prepreg is laminated onto both surfaces of the basefilm. A cover lay is provided at an opening portion of the basefilm. The cover lay may extend to a through-hole. The semirigid cover lay, made from polyimide-containing resin material, is placed to cover the opening portion, thermocompressed, and bonded to be laminated onto the surface of the basefilm. A second prepreg having an opening portion whose shape is substantially similar to the opening portion of the first prepreg, is laminated on the first prepreg.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.