Method for producing a multi-step structure in a substrate

US5635337A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Johann W. Bartha · Aidlingen, DE
• Johann Greschner · Neckartenzlingen, DE
• Karl Probst · Kornwestheim, DE
• Gerhard Schmid · Mindelheim, DE

Key dates

• Filing date: May 5, 1993
• Grant date: Jun 3, 1997
• Expiry date: May 5, 2013

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/00
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A structure of openings is produced in two or more layers of silylated, polyimide photoresist. Openings in subsequent layers, which overlap previous openings, are of larger size. Then the structure is transferred to an organic substrate using oxygen plasma etching with up to 3% CF.sub.4. The smallest opening transferred to the substrate extends through the substrate.